-
DP 5505
- For reflow soldering
- For stencil printing
- For dispensing
- Absolutely halide-free
- Lead-free alloys
- SnPb alloys
-
DP 5600
- For reflow soldering
- For stencil printing
- For dispensing
- Absolutely halide-free
- Low melting temperature
- Low voiding
-
IF 9009LT
- For reflow soldering
- For stencil printing
- For dispensing
- Lead-free alloys
- SnPb alloys
- Increased activity
-
LMPA™-Q6
- Enhanced low melting point solder paste
- High stability on the stencil
- Absolutely halide-free
- Smooth, clear and transparent residue
- Low voiding
- Reduced cost of production.
- Increased mechanical reliability
-
LP 5720
- High stability on the stencil
- Absolutely halide-free
- For SnPb(Ag) alloys
- For Lead-free alloys
- Transparent post reflow residue
-
µ-DIFE 7
- For reflow soldering
- For rework & repair
- For dipping
- Absolutely halide-free
